SCHAFFHAUSEN, Switzerland–(BUSINESS WIRE)–TE Connectivity (TE), a world leader in connectivity, today announced that it will showcase a range of industry-leading data communications connectivity solutions in booth 811 at the DesignCon 2016 Expo in Santa Clara, California on January 20-21. TE will offer both working demonstrations and displays of the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that design engineers need for their next project. TE’s input/output (I/O) interconnects, internal interconnects, power connections, active optics and cable assemblies can be seen at the booth throughout the show. These innovative solutions help address the ever increasing demand for products that are smaller, more energy efficient and faster. TE is also presenting several demonstrations highlighting its products’ high performance capabilities and next-generation solutions in rack-unit (RU) based applications.
TE Connectivity Showcases Latest Innovations at DesignCon 2016
Featured solutions will include:
- The advanced family of STRADA Whisper high speed backplane connectors, with an expanded range of configurations including direct plug orthogonal, mezzanine, and cables all delivering at least 56 Gigabit per second (Gbps).
- New Sliver internal interconnect cabled connectors that enable extended reach at 25 Gbps for on-board or embedded applications.
- The new micro quad small-form-factor pluggable (microQSFP) high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.
TE will be the first to develop microQSFP connectors and cages in accordance with the new specification released by the microQSFP Multi-Source Agreement (MSA) group on January 15, 2016. TE took the lead in forming the microQSFP MSA, and expects to have standards-compliant products in the market during the first half of 2016.
microQSFP connectors provide QSFP28 connector functionality for networking equipment, but in a smaller generally SFP-sized form factor that provides 33% higher density. microQSFP allows designers to fit up to 72 ports on a standard 1RU line card, saving significant design space. In addition, microQSFP products will offer significantly better thermal performance than any other pluggable solution on the market today, requiring less energy to cool networking equipment and increasing the ease of system thermal design.
“We are proud to showcase our cutting edge innovations like the scalable STRADA Whisper backplane solutions and to present emerging technologies like the revolutionary microQSFP pluggable interconnects,” said Phil Gilchrist, vice president and CTO, TE Data and Devices. “We enable design engineers to meet the demands of today’s and tomorrow’s data-driven world by engineering products that deliver the highest performance, reliability and energy efficiency.”
Learn more at www.te.com/designcon2016