Samtec, a privately held $625 million global manufacturer of a broad line of electronic interconnect solutions, has expanded its family of Z-Ray® micro pitch interposers to include an ultra-low-profile cable system for high-speed cable-to-board applications where space is limited. The 0.80 mm pitch system, with an overall height of less than 4 mm, features a mating compression mount interposer and a rugged metal cage.
The Z-Ray® ultra-low-profile cable assembly (ZRDP Series) features 34 AWG Eye Speed® low skew twinax ribbon cable with 8 or 16 pairs, 100 Ω differential signal routing and various end two options. With an FR4 core and BeCu micro-formed dual compression contact system, the mating interposer (ZCI Series) is available in two sizes to accommodate the cable pair count. The rugged metal cage (ZCC Series) provides secure mating between the cable and interposer, as well as compression of the interposers’ contacts to the board. Metal screws and choice of through-hole or surface mount weld tabs increase stability on the board.
“ZRDP is that rare interconnect system that combines low profile, high-density, and highspeed,” said Steve Hillerich, Samtec High-Speed Cable Product Manager. “In addition, the cable assembly system allows customers to leverage all of these capabilities over a long distance, and is available with different end two options.”
Currently in development is a Z-Ray® vertical cable system for 26+ Gbps performance in a highdensity, space saving design. Supporting this technology is Samtec’s High-Speed Cable Plant that provides in-house research and development, and manufacturing of precision extruded micro coax and twinax cable. The plant’s capabilities include 26-38 AWG center conductors, 50 Ω to 100 Ω impedance, and assemblies rated to 28+ Gbps performance.
