TE Connectivity (TE), a world leader in connectivity and sensors, announces its DMC-M high-density 30-23 modules for aerospace. Designed for EN4165, BACC65 and ARINC 809 shells, the modules achieve higher density with a reverse design that protects against damage due to exposed contacts.
“TE understands the challenges that next-generation aircraft design poses, and we are focused on continually developing new designs that save space and weight,” said Christian Cavailles, product manager, Global Aerospace, Defense & Marine, TE. “Not only have the new inserts been designed to solve the issue of fragile contact pins being bent upon blind mating, but out of the full product line they provide the highest density system in an extremely small area.”
The increased density of the new 30-position modules provides a 50 percent increase in contact counts over the existing 20-22 modules, allowing two 30-23 modules to provide the same 60-contact density as three 20-22 modules. This reduces the connector and harness sizes, enabling space and weight savings.
TE’s plastic clip technology provides additional weight savings and simplifies the assembly process, providing possible weight savings of up to 20 percent.
The high-density modules are ideal for applications such as: in-flight entertainment and cabin systems, high-speed Internet access, lighting and window dimming, power distribution and control, and electrical wiring and interconnect systems.